在電子設(shè)備中,晶振可以產(chǎn)生高度穩(wěn)定的信號(hào),使得我們電路板得以正常運(yùn)作。但是晶振的頻點(diǎn)、封裝、電壓、頻差等參數(shù)太多、選型難?怎么辦呢?
揚(yáng)興科技3分鐘幫您快速選好選對(duì)!下面是介紹148.5mhz晶振型號(hào)及封裝尺寸,幫您鎖定晶振型號(hào)需求,工溫、民溫均可滿足定制。
01、有源晶振型號(hào)
石英差分晶振:YSO230LR
封裝尺寸:3.2x2.5mm (3225),7.0x5.0mm (7050)
專屬料號(hào):OB32251485MLDC6SI,OB70501485MLDB6SI,OB70501485MLDC6SI
02、石英可編程晶振型號(hào)
石英可編程晶振:YSO690PR
封裝尺寸:3.2x2.5mm (3225),5.0x3.2mm (5032),7.0x5.0mm (7050)
專屬料號(hào):O93225148.5MEDA4SI,O95032148.5MEDA4SI,O97050148.5MEDA4SI
差分可編程晶振:YSO210PR
封裝尺寸:3.2x2.5mm (3225),5.0x3.2mm (5032),7.0x5.0mm (7050)
專屬料號(hào):OA3225148.5MEDB6SI,OA5032148.5MEDB6SI,OA5032148.5MBDB6SI,OA5032148.5MEDC6SI,OA5032148.5MBDC6SI,OA7050148.5MBDB6SI,OA7050148.5MEDB6SI
愛普生可編程晶振:SG-8018CG/CE/CA
封裝尺寸:3.2x2.5mm (3225)
專屬料號(hào):SG-8018CE 148.500000MHz TJHPA
03、MEMS硅可編程晶振型號(hào)
低抖動(dòng)晶振:YSO8209MR
封裝尺寸:3.2x2.5mm (3225),7.0x5.0mm (7050)
專屬料號(hào):O32251485MEDB4MI,O70501485MEDH4MI
低頻差分晶振:YSO9121MR
封裝尺寸:3.2x2.5mm (3225),5.0x3.2mm (5032),7.0x5.0mm (7050)
專屬料號(hào):O32251485MKDB6MI,O32251485MEDB6MI,O32251485MBDB6MI,O50321485MEDB6MI,O50321485MBDB6MI,O50321485MKDB6MI,O50321485MEDC6MI,O70501485MEDB6MI,O70501485MBDB6MI
Sitime低頻差分晶振:SIT9121
封裝尺寸:3.2x2.5mm (3225)
專屬料號(hào):SIT9121AI-2B13E148.500000D,SIT9121AI-2B23E148.500000D,SIT9121AC-2B3-25E148.500000D
Sitime差分晶振:SIT9120
封裝尺寸:3.2x2.5mm (3225),7.0x5.0mm (7050)
專屬料號(hào):SIT9120AC-2B33S148.500000DI,SIT9120AI-2D23E148.500000Y
以上是小揚(yáng)整理的常用148.5mhz晶振產(chǎn)品系列和相關(guān)料號(hào),詳細(xì)產(chǎn)品規(guī)格書可直接在YXC官網(wǎng)私聊客服小姐姐獲取!也可以讓客服小姐姐按業(yè)務(wù)與您對(duì)接,快速幫您的方案匹配選型。
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